MC10H116MG
vs
10H516/BFAJC
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
SOIC
|
|
| Package Description |
LEAD FREE, EIAJ, SO-16
|
DFP, FL16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Differential Output |
YES
|
|
| High Level Input Current-Max |
0.000095 A
|
|
| Input Characteristics |
DIFFERENTIAL
|
|
| Interface IC Type |
LINE RECEIVER
|
|
| Interface Standard |
GENERAL PURPOSE
|
|
| JESD-30 Code |
R-PDSO-G16
|
R-XDFP-F16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
10.2 mm
|
|
| Number of Functions |
3
|
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC
|
| Package Code |
SOP
|
DFP
|
| Package Equivalence Code |
SOP16,.23
|
FL16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
1.45 ns
|
|
| Receiver Number of Bits |
3
|
|
| Seated Height-Max |
2.05 mm
|
|
| Supply Current-Max |
23 mA
|
23 mA
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
5.275 mm
|
|
| Base Number Matches |
2
|
3
|
| Negative Supply Voltage-Nom |
|
-5.2 V
|
| Power Supplies |
|
-5.2 V
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Technology |
|
ECL10K
|
|
|
|
Compare MC10H116MG with alternatives