MC10EP52DTR2 vs SY10EP52VKG feature comparison

MC10EP52DTR2 onsemi

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SY10EP52VKG Microchip Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR MICROCHIP TECHNOLOGY INC
Part Package Code SOIC
Package Description PLASTIC, TSSOP-8 MSOP-8
Pin Count 8
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V NECL MODE OPERATING RANGE: VCC=0V, VEE=-3.3V TO -5.5V
Family 10E 10E
JESD-30 Code S-PDSO-G8 S-PDSO-G8
JESD-609 Code e0 e4
Length 3 mm 3 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 4000000000 Hz
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP8,.19
Package Shape SQUARE SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 235 260
Power Supply Current-Max (ICC) 47 mA
Prop. Delay@Nom-Sup 0.41 ns
Propagation Delay (tpd) 0.38 ns 0.38 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 3.63 V
Supply Voltage-Min (Vsup) 3 V 2.97 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology ECL ECL
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish TIN LEAD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE NEGATIVE EDGE
Width 3 mm 3 mm
Base Number Matches 1 1
Time@Peak Reflow Temperature-Max (s) 40
fmax-Min 4000 MHz

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