SY10EP52VKG
vs
SK10EL52WU
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
SEMTECH CORP
Package Description
MSOP-8
DIE,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
NECL MODE OPERATING RANGE: VCC=0V, VEE=-3.3V TO -5.5V
OPERATES WITH SUPPLY VOLTAGE VCC = 0V, VEE = -3.0V TO -5.5V OR VCC = 3.0V TO 5.5V, VEE = 0V
Family
10E
10EL
JESD-30 Code
S-PDSO-G8
X-XUUC-N
JESD-609 Code
e4
Length
3 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
1
1
Number of Functions
1
1
Number of Terminals
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
TSSOP
DIE
Package Shape
SQUARE
UNSPECIFIED
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
0.38 ns
0.415 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
3.63 V
5.5 V
Supply Voltage-Min (Vsup)
2.97 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.65 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
40
Trigger Type
NEGATIVE EDGE
POSITIVE EDGE
Width
3 mm
fmax-Min
4000 MHz
2200 MHz
Base Number Matches
1
1
Part Package Code
DIE
Package Equivalence Code
DIE OR CHIP
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