SY10EP52VKG
vs
SK10EL52WU
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SEMTECH CORP
|
| Package Description |
MSOP-8
|
DIE,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
NECL MODE OPERATING RANGE: VCC=0V, VEE=-3.3V TO -5.5V
|
OPERATES WITH SUPPLY VOLTAGE VCC = 0V, VEE = -3.0V TO -5.5V OR VCC = 3.0V TO 5.5V, VEE = 0V
|
| Family |
10E
|
10EL
|
| JESD-30 Code |
S-PDSO-G8
|
X-XUUC-N
|
| JESD-609 Code |
e4
|
|
| Length |
3 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
| Package Code |
TSSOP
|
DIE
|
| Package Shape |
SQUARE
|
UNSPECIFIED
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
UNCASED CHIP
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
0.38 ns
|
0.415 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
3.63 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.97 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
|
| Terminal Position |
DUAL
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Trigger Type |
NEGATIVE EDGE
|
POSITIVE EDGE
|
| Width |
3 mm
|
|
| fmax-Min |
4000 MHz
|
2200 MHz
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
DIE
|
|
|
|
Compare SY10EP52VKG with alternatives
Compare SK10EL52WU with alternatives