MC10EP31D
vs
MC10E131FNR2
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
Part Package Code |
SOIC
|
QLCC
|
Package Description |
SOP, SOP8,.25
|
QCCJ, LDCC28,.5SQ
|
Pin Count |
8
|
28
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10E
|
10E
|
JESD-30 Code |
R-PDSO-G8
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
4.9 mm
|
11.505 mm
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
2700000000 Hz
|
1000000000 Hz
|
Number of Bits |
1
|
2
|
Number of Functions |
1
|
2
|
Number of Terminals |
8
|
28
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
QCCJ
|
Package Equivalence Code |
SOP8,.25
|
LDCC28,.5SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
SMALL OUTLINE
|
CHIP CARRIER
|
Power Supply Current-Max (ICC) |
47 mA
|
70 mA
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
GULL WING
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
3.9 mm
|
11.505 mm
|
fmax-Min |
3 MHz
|
1000 MHz
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
WITH ADDITIONAL COMMON CLOCK; WITH INDIVIDUAL RESET AND CLOCK INPUTS
|
Packing Method |
|
TR
|
Propagation Delay (tpd) |
|
0.75 ns
|
|
|
|
Compare MC10EP31D with alternatives
Compare MC10E131FNR2 with alternatives