MC10E451FN
vs
MC10E451FNR2G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ONSEMI
ON SEMICONDUCTOR
Part Package Code
QLCC
QLCC
Package Description
PLASTIC, LCC-28
LEAD FREE, PLASTIC, LCC-28
Pin Count
28
28
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Additional Feature
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
Family
10E
10E
JESD-30 Code
S-PQCC-J28
S-PQCC-J28
JESD-609 Code
e0
e3
Length
11.505 mm
11.505 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Max Frequency@Nom-Sup
1100000000 Hz
1100000000 Hz
Number of Bits
6
6
Number of Functions
1
1
Number of Terminals
28
28
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
QCCJ
Package Equivalence Code
LDCC28,.5SQ
LDCC28,.5SQ
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER
CHIP CARRIER
Peak Reflow Temperature (Cel)
235
260
Power Supply Current-Max (ICC)
101 mA
101 mA
Propagation Delay (tpd)
1.05 ns
1.05 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.57 mm
4.57 mm
Supply Voltage-Max (Vsup)
5.7 V
5.7 V
Supply Voltage-Min (Vsup)
4.2 V
4.2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
ECL
ECL
Temperature Grade
OTHER
OTHER
Terminal Finish
Tin/Lead (Sn80Pb20)
TIN
Terminal Form
J BEND
J BEND
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
30
30
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
11.505 mm
11.505 mm
fmax-Min
1100 MHz
1100 MHz
Base Number Matches
4
1
Pbfree Code
Manufacturer Package Code
776-02
Moisture Sensitivity Level
3
Packing Method
TR
Compare MC10E451FN with alternatives
Compare MC10E451FNR2G with alternatives