MC10E196FNG
vs
SY100E196JI
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Obsolete
|
Not Recommended
|
Ihs Manufacturer |
ONSEMI
|
MICROCHIP TECHNOLOGY INC
|
Part Package Code |
QLCC
|
QLCC
|
Package Description |
LEAD FREE, PLASTIC, LCC-28
|
LCC-28
|
Pin Count |
28
|
28
|
Manufacturer Package Code |
776-02
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: VCC=0 WITH VEE=-4.2 V TO -5.7 V
|
|
Family |
10E
|
100E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e3
|
|
Length |
11.505 mm
|
11.48 mm
|
Logic IC Type |
ACTIVE DELAY LINE
|
SILICON DELAY LINE
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Taps/Steps |
127
|
127
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
|
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
260
|
|
Power Supply Current-Max (ICC) |
156 mA
|
|
Programmable Delay Line |
YES
|
YES
|
Prop. Delay@Nom-Sup |
4.72 ns
|
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
|
Supply Voltage-Min (Vsup) |
4.2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Tin (Sn)
|
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
|
Total Delay-Nom (td) |
3.63 ns
|
3.63 ns
|
Width |
11.505 mm
|
11.48 mm
|
Base Number Matches |
1
|
2
|
|
|
|
Compare MC10E196FNG with alternatives
Compare SY100E196JI with alternatives