MC10E155FN
vs
MC10EP35D
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
Part Package Code |
QLCC
|
SOIC
|
Package Description |
PLASTIC, LCC-28
|
SOP, SOP8,.25
|
Pin Count |
28
|
8
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.7V
|
|
Family |
10E
|
10E
|
JESD-30 Code |
S-PQCC-J28
|
R-PDSO-G8
|
JESD-609 Code |
e0
|
e0
|
Length |
11.505 mm
|
4.9 mm
|
Logic IC Type |
D LATCH
|
J-K FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
6
|
2
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
|
Number of Terminals |
28
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
SOP
|
Package Equivalence Code |
LDCC28,.5SQ
|
SOP8,.25
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
235
|
|
Power Supply Current-Max (ICC) |
102 mA
|
50 mA
|
Prop. Delay@Nom-Sup |
0.7 ns
|
0.48 ns
|
Propagation Delay (tpd) |
0.75 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
5.7 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.2 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
DUAL
|
Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
Width |
11.505 mm
|
3.9 mm
|
fmax-Min |
700 MHz
|
3500 MHz
|
Base Number Matches |
4
|
5
|
Max Frequency@Nom-Sup |
|
3000000000 Hz
|
|
|
|
Compare MC10E155FN with alternatives
Compare MC10EP35D with alternatives