MC10174FNR2
vs
5962-8756601EA
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
QP SEMICONDUCTOR INC
|
Part Package Code |
QLCC
|
DIP
|
Package Description |
PLASTIC, LCC-20
|
DIP,
|
Pin Count |
20
|
16
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10K
|
10H
|
JESD-30 Code |
S-PQCC-J20
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
2
|
4
|
Number of Inputs |
4
|
2
|
Number of Outputs |
1
|
1
|
Number of Terminals |
20
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-30 °C
|
-55 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC20,.4SQ
|
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Prop. Delay@Nom-Sup |
6.6 ns
|
|
Propagation Delay (tpd) |
6.2 ns
|
3 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
DUAL
|
Width |
8.965 mm
|
|
Base Number Matches |
1
|
1
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare MC10174FNR2 with alternatives
Compare 5962-8756601EA with alternatives