MC10160FNR2
vs
MC10166FN
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MOTOROLA INC
|
Part Package Code |
QLCC
|
|
Package Description |
PLASTIC, LCC-20
|
PLASTIC, LCC-20
|
Pin Count |
20
|
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
10K
|
10K
|
JESD-30 Code |
S-PQCC-J20
|
S-PQCC-J20
|
JESD-609 Code |
e0
|
e0
|
Length |
8.965 mm
|
8.965 mm
|
Logic IC Type |
PARITY GENERATOR/CHECKER
|
MAGNITUDE COMPARATOR
|
Number of Bits |
12
|
5
|
Number of Functions |
1
|
1
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Output Polarity |
TRUE
|
TRUE
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Propagation Delay (tpd) |
7.5 ns
|
8.4 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
4.57 mm
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
8.965 mm
|
8.965 mm
|
Base Number Matches |
3
|
4
|
Additional Feature |
|
WITH INHIBIT; WITH A < B & A > B OUTPUTS
|
Output Characteristics |
|
OPEN-EMITTER
|
Package Equivalence Code |
|
LDCC20,.4SQ
|
Power Supply Current-Max (ICC) |
|
117 mA
|
|
|
|
Compare MC10160FNR2 with alternatives
Compare MC10166FN with alternatives