MC10135P
vs
10135N
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MOTOROLA INC
|
PHILIPS SEMICONDUCTORS
|
Package Description |
PLASTIC, DIP-16
|
DIP-16
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
WITH INDIVIDUAL SET AND RESET INPUTS
|
|
Family |
10K
|
|
JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Length |
19.175 mm
|
|
Logic IC Type |
JBAR-KBAR FLIP-FLOP
|
J-K FLIP-FLOP
|
Max Frequency@Nom-Sup |
5200000 Hz
|
125000000 Hz
|
Number of Bits |
2
|
|
Number of Functions |
1
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
COMPLEMENTARY
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Power Supply Current-Max (ICC) |
75 mA
|
75 mA
|
Propagation Delay (tpd) |
4.6 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.44 mm
|
|
Surface Mount |
NO
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Trigger Type |
POSITIVE EDGE
|
MASTER-SLAVE
|
Width |
7.62 mm
|
|
fmax-Min |
125 MHz
|
|
Base Number Matches |
5
|
2
|
|
|
|