MC10130P
vs
10130F
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
NXP SEMICONDUCTORS
|
| Package Description |
PLASTIC, DIP-16
|
DIP, DIP16,.3
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
WITH ADDITIONAL COMMON LATCH ENABLE; SET AND RESET ACTIVE ONLY WHEN LATCH ENABLE IS HIGH
|
WITH ADDITIONAL COMMON LATCH ENABLE
|
| Family |
10K
|
10K
|
| JESD-30 Code |
R-PDIP-T16
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
19.175 mm
|
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Number of Bits |
1
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-30 °C
|
-30 °C
|
| Output Characteristics |
OPEN-EMITTER
|
OPEN-EMITTER
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
38 mA
|
35 mA
|
| Prop. Delay@Nom-Sup |
4.3 ns
|
4.3 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.44 mm
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
LOW LEVEL
|
LOW LEVEL
|
| Width |
7.62 mm
|
|
| Base Number Matches |
3
|
4
|
| Pbfree Code |
|
No
|
|
|
|
Compare MC10130P with alternatives
Compare 10130F with alternatives