MC10102L vs 10102F feature comparison

MC10102L Freescale Semiconductor

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10102F YAGEO Corporation

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS PHILIPS COMPONENTS
Package Description DIP, DIP16,.3 DIP-16
Reach Compliance Code unknown unknown
JESD-30 Code R-XDIP-T16 R-GDIP-T16
JESD-609 Code e0
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Package Body Material CERAMIC CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Power Supplies -5.2 V
Power Supply Current-Max (ICC) 29 mA 29 mA
Prop. Delay@Nom-Sup 3.3 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Surface Mount NO NO
Technology ECL10K ECL
Temperature Grade OTHER OTHER
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Base Number Matches 5 5
HTS Code 8542.39.00.01
Additional Feature COMPLEMENTARY OUTPUT FOR 1 FUNCTION
Family 10K
Load Capacitance (CL) 3 pF
Logic IC Type NOR GATE
Number of Functions 4
Number of Inputs 2
Output Characteristics OPEN-EMITTER
Propagation Delay (tpd) 3.3 ns
Supply Voltage-Max (Vsup) -5.72 V
Supply Voltage-Min (Vsup) -4.68 V
Supply Voltage-Nom (Vsup) -5.2 V

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