MC100LVEL59DW
vs
MC100LVEL58MNR4
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
ON SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
DFN
|
| Package Description |
SOP, SOP20,.4
|
DFN-8
|
| Pin Count |
20
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
100LVEL
|
100LVEL
|
| JESD-30 Code |
R-PDSO-G20
|
S-PDSO-N8
|
| JESD-609 Code |
e0
|
e0
|
| Length |
12.8 mm
|
2 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
3
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
20
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
HVSON
|
| Package Equivalence Code |
SOP20,.4
|
SOLCC8,.08,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Power Supply Current-Max (ICC) |
32 mA
|
30 mA
|
| Propagation Delay (tpd) |
0.69 ns
|
0.57 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.65 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.5 mm
|
2 mm
|
| Base Number Matches |
5
|
1
|
| Rohs Code |
|
No
|
| Additional Feature |
|
NECL MODE: VCC = 0V WITH VEE = -3V TO -3.8V
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Prop. Delay@Nom-Sup |
|
0.59 ns
|
| Supply Voltage-Max (Vsup) |
|
3.8 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
|
|
|
Compare MC100LVEL59DW with alternatives
Compare MC100LVEL58MNR4 with alternatives