MC100ES6139DT
vs
MC100EP139DTR2G
feature comparison
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ONSEMI
|
| Part Package Code |
TSSOP
|
TSSOP 20 LEAD
|
| Package Description |
TSSOP, TSSOP20,.25
|
TSSOP-20
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
ECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.8V
|
NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
|
| Family |
100E
|
100E
|
| Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
| Length |
6.5 mm
|
6.5 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
20
|
20
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP20,.25
|
TSSOP20,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
0.85 ns
|
1.1 ns
|
| Propagation Delay (tpd) |
0.9 ns
|
0.9 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Same Edge Skew-Max (tskwd) |
0.1 ns
|
0.1 ns
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.8 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
Yes
|
| Manufacturer Package Code |
|
9.48
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
onsemi
|
| JESD-609 Code |
|
e4
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare MC100ES6139DT with alternatives
Compare MC100EP139DTR2G with alternatives