MC100E175FNR2
vs
SY10EP451LTG
feature comparison
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ON SEMICONDUCTOR
|
MICREL INC
|
Part Package Code |
QLCC
|
QFP
|
Package Description |
PLASTIC, LCC-28
|
TQFP,
|
Pin Count |
28
|
32
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
NECL MODE: VCC = 0V WITH VEE = -4.2V TO -5.5V
|
|
Family |
100E
|
10E
|
JESD-30 Code |
S-PQCC-J28
|
S-PQFP-G32
|
JESD-609 Code |
e0
|
e4
|
Length |
11.505 mm
|
7 mm
|
Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
9
|
1
|
Number of Functions |
1
|
6
|
Number of Terminals |
28
|
32
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Characteristics |
OPEN-EMITTER
|
|
Output Polarity |
TRUE
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
TQFP
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
FLATPACK, THIN PROFILE
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
235
|
|
Power Supply Current-Max (ICC) |
152 mA
|
|
Prop. Delay@Nom-Sup |
1.45 ns
|
|
Propagation Delay (tpd) |
0.8 ns
|
0.69 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
4.2 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
J BEND
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Trigger Type |
LOW LEVEL
|
POSITIVE EDGE
|
Width |
11.505 mm
|
7 mm
|
fmax-Min |
700 MHz
|
|
Base Number Matches |
3
|
2
|
|
|
|
Compare MC100E175FNR2 with alternatives
Compare SY10EP451LTG with alternatives