MBM29LV800TE70PBT-E1
vs
M29W800FT7AZA6ST
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SPANSION INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
PLASTIC, FBGA-48
6 X 8 MM, 0.80 MM PITCH, TFBGA-48
Pin Count
48
48
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
70 ns
70 ns
Alternate Memory Width
8
8
Boot Block
TOP
TOP
JESD-30 Code
R-PBGA-B48
R-PBGA-B48
Length
8 mm
8 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
524288 words
524288 words
Number of Words Code
512000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
512KX16
512KX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
240
Programming Voltage
3 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Type
NOR TYPE
NOR TYPE
Width
6 mm
6 mm
Base Number Matches
1
1
Additional Feature
TOP BOOT BLOCK
Compare MBM29LV800TE70PBT-E1 with alternatives
Compare M29W800FT7AZA6ST with alternatives