MBM29LV800TE70PBT-E1 vs M29W800DXT70ZA1 feature comparison

MBM29LV800TE70PBT-E1 Spansion

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M29W800DXT70ZA1 STMicroelectronics

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SPANSION INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description PLASTIC, FBGA-48 6 X 9 MM, 0.80 MM PITCH, TFBGA-48
Pin Count 48 48
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 70 ns 70 ns
Alternate Memory Width 8 8
Boot Block TOP TOP
JESD-30 Code R-PBGA-B48 R-PBGA-B48
Length 8 mm 9 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 512KX16 512KX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 240
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Base Number Matches 1 4
Rohs Code No
Additional Feature TOP BOOT BLOCK
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Number of Sectors/Size 1,2,1,15
Package Equivalence Code BGA48,6X8,32
Ready/Busy YES
Sector Size 16K,8K,32K,64K
Standby Current-Max 0.0001 A
Supply Current-Max 0.02 mA
Terminal Finish TIN LEAD
Toggle Bit YES

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