MBM29LV800BA-90PBT-SF2
vs
S29GL032N90TFI010
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
FUJITSU SEMICONDUCTOR AMERICA INC
|
CYPRESS SEMICONDUCTOR CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
PLASTIC, FBGA-48
|
|
| Pin Count |
48
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
3A991.B.1.A
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Access Time-Max |
90 ns
|
90 ns
|
| Additional Feature |
MINIMUM 100000 PROGRAM/ERASE CYCLES
|
|
| Alternate Memory Width |
8
|
8
|
| Boot Block |
BOTTOM
|
BOTTOM/TOP
|
| JESD-30 Code |
R-PBGA-B48
|
R-PDSO-G56
|
| Length |
9 mm
|
18.4 mm
|
| Memory Density |
8388608 bit
|
33554432 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
56
|
| Number of Words |
524288 words
|
2097152 words
|
| Number of Words Code |
512000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Organization |
512KX16
|
2MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TFBGA
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Programming Voltage |
3 V
|
3 V
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
DUAL
|
| Type |
NOR TYPE
|
NOR TYPE
|
| Width |
6 mm
|
14 mm
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| Command User Interface |
|
YES
|
| Common Flash Interface |
|
YES
|
| Data Polling |
|
YES
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Number of Sectors/Size |
|
64
|
| Package Equivalence Code |
|
TSSOP56,.8,20
|
| Page Size |
|
8/16 words
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Ready/Busy |
|
YES
|
| Sector Size |
|
64K
|
| Standby Current-Max |
|
0.000005 A
|
| Supply Current-Max |
|
0.05 mA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Toggle Bit |
|
YES
|
|
|
|
Compare MBM29LV800BA-90PBT-SF2 with alternatives
Compare S29GL032N90TFI010 with alternatives