MBM29F002TC-55PTN
vs
M29F002BT55N6E
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU LTD
NUMONYX
Package Description
PLASTIC, TSOP1-32
8 X 20 MM, LEAD FREE, PLASTIC, TSOP-32
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
Access Time-Max
55 ns
55 ns
Boot Block
TOP
TOP
JESD-30 Code
R-PDSO-G32
R-PDSO-G32
Length
18.4 mm
18.4 mm
Memory Density
2097152 bit
2097152 bit
Memory IC Type
FLASH
FLASH
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
32
32
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX8
256KX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
5 V
5 V
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
NOR TYPE
NOR TYPE
Width
8 mm
8 mm
Base Number Matches
1
1
Part Package Code
TSOP
Pin Count
32
Additional Feature
TOP BOOT BLOCK
JESD-609 Code
e3/e6
Peak Reflow Temperature (Cel)
260
Supply Current-Max
0.02 mA
Terminal Finish
TIN/TIN BISMUTH
Time@Peak Reflow Temperature-Max (s)
40
Compare MBM29F002TC-55PTN with alternatives
Compare M29F002BT55N6E with alternatives