MBM29DL324BE-90TR vs K8D3216UBC-PC090 feature comparison

MBM29DL324BE-90TR FUJITSU Limited

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K8D3216UBC-PC090 Samsung Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP1 TSOP1
Package Description TSOP1-R, 12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
Pin Count 48 48
Reach Compliance Code unknown compliant
Access Time-Max 90 ns 90 ns
Alternate Memory Width 8 8
JESD-30 Code R-PDSO-G48 R-PDSO-G48
Length 18.4 mm 18.4 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP1-R TSOP1
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL DUAL
Width 12 mm 12 mm
Base Number Matches 1 1
Rohs Code Yes
ECCN Code EAR99
HTS Code 8542.32.00.51
Boot Block BOTTOM
Command User Interface YES
Common Flash Interface YES
Data Polling YES
Moisture Sensitivity Level 3
Number of Sectors/Size 8,63
Package Equivalence Code TSSOP48,.8,20
Ready/Busy YES
Sector Size 8K,64K
Standby Current-Max 0.000018 A
Supply Current-Max 0.05 mA
Toggle Bit YES
Type NOR TYPE

Compare MBM29DL324BE-90TR with alternatives

Compare K8D3216UBC-PC090 with alternatives