K8D3216UBC-PC090
vs
MBM29DL322TE-90TN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
SAMSUNG SEMICONDUCTOR INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
TSOP1
TSOP1
Package Description
12 X 20 MM, 0.50 MM PITCH, LEAD FREE, PLASTIC, TSOP1-48
TSOP1,
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.51
Access Time-Max
90 ns
90 ns
Alternate Memory Width
8
8
Boot Block
BOTTOM
Command User Interface
YES
Common Flash Interface
YES
Data Polling
YES
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
Length
18.4 mm
18.4 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Moisture Sensitivity Level
3
Number of Functions
1
1
Number of Sectors/Size
8,63
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
2MX16
2MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSOP1
Package Equivalence Code
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
2.7 V
Qualification Status
Not Qualified
Not Qualified
Ready/Busy
YES
Seated Height-Max
1.2 mm
1.2 mm
Sector Size
8K,64K
Standby Current-Max
0.000018 A
Supply Current-Max
0.05 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Toggle Bit
YES
Type
NOR TYPE
Width
12 mm
12 mm
Base Number Matches
1
1
Compare K8D3216UBC-PC090 with alternatives
Compare MBM29DL322TE-90TN with alternatives