MBM29DL323TE-80PBT vs MBM29DL323TE80PBT feature comparison

MBM29DL323TE-80PBT FUJITSU Limited

Buy Now Datasheet

MBM29DL323TE80PBT Spansion

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU SEMICONDUCTOR AMERICA INC SPANSION INC
Part Package Code BGA BGA
Package Description TFBGA, TFBGA, BGA63,8X12,32
Pin Count 63 63
Reach Compliance Code unknown compliant
Access Time-Max 80 ns 80 ns
Alternate Memory Width 8 8
JESD-30 Code R-PBGA-B63 R-PBGA-B63
Length 11 mm 11 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 63 63
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 7 mm 7 mm
Base Number Matches 2 2
Rohs Code No
ECCN Code EAR99
HTS Code 8542.32.00.51
Additional Feature ALSO CONFIGURABLE AS 4M X 8
Boot Block TOP
Command User Interface YES
Common Flash Interface YES
Data Polling YES
JESD-609 Code e0
Number of Sectors/Size 8,63
Package Equivalence Code BGA63,8X12,32
Ready/Busy YES
Sector Size 8K,64K
Standby Current-Max 0.000005 A
Supply Current-Max 0.053 mA
Terminal Finish TIN LEAD
Toggle Bit YES
Type NOR TYPE

Compare MBM29DL323TE-80PBT with alternatives

Compare MBM29DL323TE80PBT with alternatives