MBM27C256A-20WZ
vs
TMS27C256-20JE4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
TEXAS INSTRUMENTS INC
Part Package Code
DIP
DIP
Package Description
WDIP,
WDIP, DIP28,.6
Pin Count
28
28
Reach Compliance Code
unknown
compliant
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-GDIP-T28
R-CDIP-T28
Length
36.83 mm
36.83 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, METAL-SEALED COFIRED
Package Code
WDIP
WDIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.84 mm
4.91 mm
Supply Current-Max
0.03 mA
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
2
Rohs Code
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP28,.6
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programming Voltage
13 V
Standby Current-Max
0.00025 A
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MBM27C256A-20WZ with alternatives
Compare TMS27C256-20JE4 with alternatives