MBM27C256A-20WZ
vs
NMC27C256BQ200
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Contact Manufacturer
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
ROCHESTER ELECTRONICS LLC
Part Package Code
DIP
Package Description
WDIP,
DIP,
Pin Count
28
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
EAR99
HTS Code
8542.32.00.61
8542.32.00.61
Access Time-Max
200 ns
200 ns
JESD-30 Code
R-GDIP-T28
R-GDIP-T28
Length
36.83 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
UVPROM
UVPROM
Memory Width
8
8
Number of Functions
1
1
Number of Terminals
28
28
Number of Words
32768 words
32768 words
Number of Words Code
32000
32000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
32KX8
32KX8
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
WDIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE, WINDOW
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.84 mm
5.715 mm
Supply Current-Max
0.03 mA
0.02 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
15.24 mm
15.24 mm
Base Number Matches
2
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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