MB95F282KPF-G-SNE1
vs
MC9S08SH8MSCR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
FUJITSU LTD
NXP SEMICONDUCTORS
Package Description
10.15 X 5.30 MM, 2.25 MM HEIGHT, 1.27 MM PITCH, PLASTIC, SOP-16
MS-012AA, SOIC-8
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
CPU Family
F2MC-8
Clock Frequency-Max
32.5 MHz
38.4 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G16
R-PDSO-G8
Length
10.175 mm
4.9 mm
Number of I/O Lines
13
6
Number of Terminals
16
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.3
SOP8,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
240
512
ROM (words)
8192
8192
ROM Programmability
FLASH
FLASH
Seated Height-Max
2.25 mm
Speed
32.5 MHz
40 MHz
Supply Current-Max
39.5 mA
7.7 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.3 V
2.7 V
Supply Voltage-Nom
5 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
5.3 mm
3.9 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
4
2
Boundary Scan
NO
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