MC9S08SH8MSCR
vs
MC9S08SH8CFK
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ROCHESTER ELECTRONICS LLC
Package Description
MS-012AA, SOIC-8
4 X 4 MM, 1 MM HEIGHT, MO-220VGGD-6, QFN-24
Reach Compliance Code
compliant
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
8
8
Boundary Scan
NO
Clock Frequency-Max
38.4 MHz
16 MHz
DAC Channels
NO
NO
DMA Channels
NO
NO
External Data Bus Width
JESD-30 Code
R-PDSO-G8
S-PQCC-N24
Length
4.9 mm
4 mm
Number of I/O Lines
6
18
Number of Terminals
8
24
On Chip Program ROM Width
8
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
HVQCCN
Package Equivalence Code
SOP8,.25
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Qualification Status
Not Qualified
RAM (bytes)
512
ROM (words)
8192
ROM Programmability
FLASH
FLASH
Speed
40 MHz
40 MHz
Supply Current-Max
7.7 mA
Supply Voltage-Max
5.5 V
5.5 V
Supply Voltage-Min
2.7 V
2.7 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
0.5 mm
Terminal Position
DUAL
QUAD
Width
3.9 mm
4 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER
MICROCONTROLLER
Base Number Matches
2
3
Pbfree Code
Part Package Code
QFN
Pin Count
24
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1 mm
Terminal Finish
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
40
Compare MC9S08SH8MSCR with alternatives
Compare MC9S08SH8CFK with alternatives