MB8508S064CF-100DG vs KMM466S823DT2-G0 feature comparison

MB8508S064CF-100DG FUJITSU Semiconductor Limited

Buy Now Datasheet

KMM466S823DT2-G0 Samsung Semiconductor

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code DIMM MODULE
Package Description , DIMM, DIMM144,32
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.28 8542.32.00.28
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 8.5 ns 7 ns
JESD-30 Code R-XDMA-N144 R-XDMA-N144
Memory Density 536870912 bit 536870912 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 8MX64 8MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form NO LEAD NO LEAD
Terminal Position DUAL DUAL
Base Number Matches 2 1
Additional Feature AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 100 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Code DIMM
Package Equivalence Code DIMM144,32
Refresh Cycles 4096
Seated Height-Max 29.21 mm
Self Refresh YES
Standby Current-Max 0.008 A
Supply Current-Max 1 mA
Terminal Pitch 0.8 mm

Compare MB8508S064CF-100DG with alternatives

Compare KMM466S823DT2-G0 with alternatives