MB84VD22280FA-70PBS-E1
vs
MB84VD22180FM-70PBS
feature comparison
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
SPANSION INC
|
FUJITSU LTD
|
Part Package Code |
BGA
|
|
Package Description |
TFBGA,
|
LFBGA, BGA59,8X10,32
|
Pin Count |
59
|
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.71
|
8542.32.00.71
|
Additional Feature |
SRAM IS ORGANIZED AS 512K X 16
|
SRAM IS ORGANIZED AS 256K X 16
|
JESD-30 Code |
R-PBGA-B59
|
R-PBGA-B59
|
JESD-609 Code |
e1
|
e0
|
Length |
9 mm
|
9 mm
|
Memory Density |
33554432 bit
|
33554432 bit
|
Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
59
|
59
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-30 °C
|
-30 °C
|
Organization |
2MX16
|
2MX16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TFBGA
|
LFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, THIN PROFILE, FINE PITCH
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.2 mm
|
1.24 mm
|
Supply Voltage-Max (Vsup) |
3.1 V
|
3.1 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Finish |
TIN SILVER COPPER
|
TIN LEAD
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Width |
7 mm
|
7 mm
|
Base Number Matches |
1
|
1
|
Access Time-Max |
|
70 ns
|
Mixed Memory Type |
|
FLASH+SRAM
|
Package Equivalence Code |
|
BGA59,8X10,32
|
Standby Current-Max |
|
0.00001 A
|
Supply Current-Max |
|
0.043 mA
|
|
|
|
Compare MB84VD22280FA-70PBS-E1 with alternatives
Compare MB84VD22180FM-70PBS with alternatives