MB82D01171A-80LLPBN vs K1S161611A-BI700 feature comparison

MB82D01171A-80LLPBN FUJITSU Semiconductor Limited

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K1S161611A-BI700 Samsung Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer FUJITSU LTD SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description TFBGA, BGA48,6X8,30 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 80 ns 70 ns
Additional Feature ALSO OPERATES AT 2.7V TO 3.1V SUPPLY
I/O Type COMMON
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e0 e1
Length 9 mm 7 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type STANDARD SRAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -40 °C
Organization 1MX16 1MX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA VFBGA
Package Equivalence Code BGA48,6X8,30
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1 mm
Standby Current-Max 0.00007 A
Supply Current-Max 0.025 mA
Supply Voltage-Max (Vsup) 2.7 V 3.1 V
Supply Voltage-Min (Vsup) 2.3 V 2.7 V
Supply Voltage-Nom (Vsup) 2.5 V 2.9 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN LEAD TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 2 1
Moisture Sensitivity Level 2

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