K1S161611A-BI700 vs MB82D01171A-90LPBT feature comparison

K1S161611A-BI700 Samsung Semiconductor

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MB82D01171A-90LPBT FUJITSU Semiconductor Limited

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer SAMSUNG SEMICONDUCTOR INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code BGA BGA
Package Description 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48 PLASTIC, FBGA-48
Pin Count 48 48
Reach Compliance Code compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 70 ns 90 ns
JESD-30 Code R-PBGA-B48 R-PBGA-B48
JESD-609 Code e1
Length 7 mm 9 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type PSEUDO STATIC RAM STANDARD SRAM
Memory Width 16 16
Moisture Sensitivity Level 2
Number of Functions 1 1
Number of Terminals 48 48
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -25 °C
Organization 1MX16 1MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.1 V 2.7 V
Supply Voltage-Min (Vsup) 2.7 V 2.3 V
Supply Voltage-Nom (Vsup) 2.9 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL OTHER
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 2
Additional Feature IT CAN ALSO OPERATE WITH 2.7V TO 3.1V SUPPLY
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare K1S161611A-BI700 with alternatives

Compare MB82D01171A-90LPBT with alternatives