MB81464-12PD
vs
LH2464-12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
SHARP CORP
Package Description
QCCJ,
0.300 INCH, PLASTIC, DIP-18
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.02
Access Mode
PAGE
PAGE
Access Time-Max
120 ns
120 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code
R-PQCC-J18
R-PDIP-T18
Length
12.45 mm
23 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
QCCJ
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
4.4 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
NMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
7.24 mm
7.62 mm
Base Number Matches
1
1
Rohs Code
JESD-609 Code
e0
Output Characteristics
3-STATE
Refresh Cycles
256
Terminal Finish
TIN LEAD
Compare MB81464-12PD with alternatives
Compare LH2464-12 with alternatives