MB81464-12PD
vs
SMJ4464-12JDL
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
TEXAS INSTRUMENTS INC
Package Description
QCCJ,
0.300 INCH, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-18
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
PAGE
PAGE
Access Time-Max
120 ns
120 ns
Additional Feature
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH
JESD-30 Code
R-PQCC-J18
R-CDIP-T18
Length
12.45 mm
22.606 mm
Memory Density
262144 bit
262144 bit
Memory IC Type
PAGE MODE DRAM
PAGE MODE DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
18
18
Number of Words
65536 words
65536 words
Number of Words Code
64000
64000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
64KX4
64KX4
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
QCCJ
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER
IN-LINE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.55 mm
5.08 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
NMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
J BEND
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
QUAD
DUAL
Width
7.24 mm
7.62 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
Part Package Code
DIP
Pin Count
18
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIP18,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Refresh Cycles
256
Screening Level
38535Q/M;38534H;883B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MB81464-12PD with alternatives
Compare SMJ4464-12JDL with alternatives