MB7122EZ
vs
DM74S572AN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
FUJITSU SEMICONDUCTOR AMERICA INC
NATIONAL SEMICONDUCTOR CORP
Package Description
DIP,
PLASTIC, DIP-18
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
45 ns
45 ns
JESD-30 Code
R-GDIP-T18
R-PDIP-T18
Length
22.61 mm
21.755 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
OTP ROM
OTP ROM
Memory Width
4
4
Number of Functions
1
1
Number of Terminals
18
18
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
Organization
1KX4
1KX4
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
5.08 mm
Supply Current-Max
0.15 mA
0.14 mA
Supply Voltage-Max (Vsup)
5.25 V
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
4.75 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
BIPOLAR
BIPOLAR
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
2
Rohs Code
JESD-609 Code
e0
Output Characteristics
OPEN-COLLECTOR
Package Equivalence Code
DIP18,.3
Terminal Finish
Tin/Lead (Sn/Pb)
Compare MB7122EZ with alternatives
Compare DM74S572AN with alternatives