MAX9879ERV+TCEP
vs
TPA6130A2RTJTG4
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
| Package Description |
,
|
HVQCCN, LCC20,.16SQ,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Channel Separation |
75 dB
|
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| JESD-30 Code |
R-PBGA-B30
|
S-PQCC-N20
|
| JESD-609 Code |
e1
|
e4
|
| Length |
3.05 mm
|
4 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Channels |
3
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
30
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
HVQCCN
|
| Package Equivalence Code |
BGA30,5X6,20
|
LCC20,.16SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.69 mm
|
0.8 mm
|
| Supply Current-Max |
24 mA
|
6 mA
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
|
| Terminal Finish |
TIN SILVER COPPER
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
BALL
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
2.54 mm
|
4 mm
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFN
|
| Pin Count |
|
20
|
| Samacsys Manufacturer |
|
Texas Instruments
|
| Harmonic Distortion |
|
1%
|
| Output Power-Nom |
|
0.138 W
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare MAX9879ERV+TCEP with alternatives
Compare TPA6130A2RTJTG4 with alternatives