MAX9879ERV+TCEP
vs
TPA6140A2YFFR
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
,
|
1.6 X 1.6 MM, 0.4 MM PITCH, GREEN, DSBGA-16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.33.00.01
|
Channel Separation |
75 dB
|
80 dB
|
Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
JESD-30 Code |
R-PBGA-B30
|
S-PBGA-B16
|
JESD-609 Code |
e1
|
e1
|
Length |
3.05 mm
|
1.905 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
3
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
30
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA30,5X6,20
|
BGA16,4X4,16
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
0.69 mm
|
0.625 mm
|
Supply Current-Max |
24 mA
|
2 mA
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
1.7 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
|
Terminal Finish |
TIN SILVER COPPER
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
2.54 mm
|
1.905 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
16
|
Samacsys Manufacturer |
|
Texas Instruments
|
Harmonic Distortion |
|
10%
|
Output Power-Nom |
|
0.025 W
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare MAX9879ERV+TCEP with alternatives
Compare TPA6140A2YFFR with alternatives