MAX98091ETM+
vs
AK4673EG
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ASAHI KASEI MICRODEVICES CORP
|
| Package Description |
,
|
VFBGA,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Filter |
YES
|
YES
|
| Input Code |
TWOS COMPLEMENT
|
|
| Input Type |
SINGLE-ENDED/DIFF
|
|
| JESD-30 Code |
S-XQCC-N48
|
S-PBGA-B57
|
| JESD-609 Code |
e3
|
e1
|
| Length |
6 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
6
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
57
|
| Operating Mode |
SYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-30 °C
|
| Output |
VOLTAGE
|
|
| Output Code |
TWOS COMPLEMENT
|
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVQCCN
|
VFBGA
|
| Package Equivalence Code |
LCC48,.24SQ,16
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Seated Height-Max |
0.8 mm
|
1 mm
|
| Supply Voltage-Nom |
1.2 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Telecom IC Type |
PCM CODEC
|
PCM CODEC
|
| Terminal Finish |
MATTE TIN
|
TIN SILVER COPPER
|
| Terminal Form |
NO LEAD
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
6 mm
|
5 mm
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
57
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
OTHER
|
|
|
|
Compare MAX98091ETM+ with alternatives
Compare AK4673EG with alternatives