MAX9725CEBC+G45
vs
MAX9725DEBC+TG45
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Package Description |
,
|
VFBGA, BGA12,3X4,20
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-609 Code |
e1
|
e1
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
12
|
| Bandwidth-Nom |
|
22 kHz
|
| JESD-30 Code |
|
R-PBGA-B12
|
| Length |
|
2.02 mm
|
| Number of Channels |
|
2
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
12
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Power-Nom |
|
0.025 W
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
VFBGA
|
| Package Equivalence Code |
|
BGA12,3X4,20
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
0.67 mm
|
| Supply Current-Max |
|
3.3 mA
|
| Supply Voltage-Max (Vsup) |
|
1.8 V
|
| Supply Voltage-Min (Vsup) |
|
0.9 V
|
| Surface Mount |
|
YES
|
| Technology |
|
BICMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.5 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
1.54 mm
|
|
|
|
Compare MAX9725CEBC+G45 with alternatives
Compare MAX9725DEBC+TG45 with alternatives