MAX9725DEBC+TG45
vs
MAX9725EEBC+TG45
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
BGA
|
BGA
|
Package Description |
VFBGA, BGA12,3X4,20
|
VFBGA, BGA12,3X4,20
|
Pin Count |
12
|
12
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
22 kHz
|
Consumer IC Type |
AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
JESD-30 Code |
R-PBGA-B12
|
R-PBGA-B12
|
JESD-609 Code |
e1
|
e1
|
Length |
2.02 mm
|
2.02 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Channels |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
12
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
0.025 W
|
0.025 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Equivalence Code |
BGA12,3X4,20
|
BGA12,3X4,20
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.67 mm
|
0.67 mm
|
Supply Current-Max |
3.3 mA
|
3.3 mA
|
Supply Voltage-Max (Vsup) |
1.8 V
|
1.8 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
0.9 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
1.54 mm
|
1.54 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MAX9725DEBC+TG45 with alternatives
Compare MAX9725EEBC+TG45 with alternatives