MAX9700BEBC+
vs
TPA2001D1GQC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
TEXAS INSTRUMENTS INC
|
Package Description |
VFBGA,
|
VFBGA, BGA48,7X7,20
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Bandwidth-Nom |
22 kHz
|
20 kHz
|
Consumer IC Type |
CLASS D AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
Gain |
12 dB
|
6 dB
|
JESD-30 Code |
R-PBGA-B12
|
S-PBGA-B48
|
JESD-609 Code |
e1
|
|
Length |
2.02 mm
|
4 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Channels |
1
|
1
|
Number of Functions |
1
|
1
|
Number of Terminals |
12
|
48
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Power-Nom |
1.6 W
|
1 W
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VFBGA
|
VFBGA
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Seated Height-Max |
0.67 mm
|
1 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.5 V
|
2.7 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.54 mm
|
4 mm
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
BGA
|
Pin Count |
|
48
|
Harmonic Distortion |
|
1%
|
Package Equivalence Code |
|
BGA48,7X7,20
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
6 mA
|
|
|
|
Compare MAX9700BEBC+ with alternatives
Compare TPA2001D1GQC with alternatives