MAX9317ETJ
vs
MAX9317AETJ+T
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
MAXIM INTEGRATED PRODUCTS INC
|
Part Package Code |
QFN
|
|
Package Description |
5 X 5 MM, 0.80 MM HEIGHT, THIN, QFN-32
|
|
Pin Count |
32
|
|
Reach Compliance Code |
not_compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-CQCC-N32
|
S-XQCC-N32
|
JESD-609 Code |
e0
|
|
Length |
5 mm
|
5 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Inverted Outputs |
|
|
Number of Terminals |
32
|
32
|
Number of True Outputs |
5
|
10
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
UNSPECIFIED
|
Package Code |
VQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Prop. Delay@Nom-Sup |
0.6 ns
|
0.6 ns
|
Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
Qualification Status |
Not Qualified
|
|
Same Edge Skew-Max (tskwd) |
0.045 ns
|
0.025 ns
|
Seated Height-Max |
0.8 mm
|
0.8 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
BIPOLAR
|
BIPOLAR
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
5 mm
|
5 mm
|
fmax-Min |
1000 MHz
|
|
Base Number Matches |
1
|
2
|
Family |
|
9317
|
Packing Method |
|
TR
|
Power Supply Current-Max (ICC) |
|
107 mA
|
|
|
|
Compare MAX9317ETJ with alternatives
Compare MAX9317AETJ+T with alternatives