MAX9214ETM+
vs
DS90CR216AMTDX/NOPB
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
QFN
|
|
| Package Description |
VQCCN,
|
TSSOP, TSSOP48,.3,20
|
| Pin Count |
48
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL SCHMITT TRIGGER
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
EIA-644; TIA-644
|
EIA-644; TIA-644
|
| JESD-30 Code |
S-XQCC-N48
|
R-PDSO-G48
|
| JESD-609 Code |
e3
|
e3
|
| Length |
7 mm
|
12.5 mm
|
| Moisture Sensitivity Level |
1
|
2
|
| Number of Functions |
4
|
3
|
| Number of Terminals |
48
|
48
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
TSSOP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receiver Number of Bits |
4
|
3
|
| Seated Height-Max |
0.8 mm
|
1.2 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
Matte Tin (Sn)
|
| Terminal Form |
NO LEAD
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Width |
7 mm
|
6.1 mm
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
TSSOP48,.3,20
|
| Receive Delay-Max |
|
|
| Supply Current-Max |
|
105 mA
|
|
|
|
Compare MAX9214ETM+ with alternatives
Compare DS90CR216AMTDX/NOPB with alternatives