MAX9179ETE-T
vs
MAX9173ETE
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
HVQCCN,
|
3 X 3 MM, 0.80 MM HEIGHT, EXPOSED PAD, TQFN-16
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Input Characteristics |
DIFFERENTIAL
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
EIA-644; TIA-644
|
EIA-644; TIA-644; IEEE 1596.3
|
| JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
| JESD-609 Code |
e0
|
e0
|
| Length |
4 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
4
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Receive Delay-Max |
4.6 ns
|
2.7 ns
|
| Receiver Number of Bits |
4
|
4
|
| Seated Height-Max |
0.8 mm
|
0.8 mm
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
3 V
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
4 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare MAX9179ETE-T with alternatives
Compare MAX9173ETE with alternatives