MAX7311AUG+
vs
MAX7311AWG+
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
ANALOG DEVICES INC
|
Part Package Code |
24-TSSOP_4.4-4.4_MM
|
24-SOIC_W-300_MIL
|
Package Description |
MO-153AD, TSSOP-24
|
MS-013, SO-24
|
Pin Count |
24
|
24
|
Manufacturer Package Code |
24-TSSOP_4.4-4.4_MM
|
24-SOIC_W-300_MIL
|
Reach Compliance Code |
compliant
|
compliant
|
Date Of Intro |
2003-02-13
|
2003-02-13
|
Samacsys Manufacturer |
Analog Devices
|
Analog Devices
|
Clock Frequency-Max |
0.4 MHz
|
0.4 MHz
|
External Data Bus Width |
|
|
JESD-30 Code |
S-PDSO-G24
|
R-PDSO-G24
|
JESD-609 Code |
e3
|
e3
|
Length |
7.8 mm
|
15.4 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Bits |
16
|
16
|
Number of I/O Lines |
16
|
16
|
Number of Ports |
2
|
2
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
SOP
|
Package Equivalence Code |
TSSOP24,.25
|
SOP24,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
2.65 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2 V
|
2 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
BICMOS
|
BICMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
Width |
4.4 mm
|
7.5 mm
|
uPs/uCs/Peripheral ICs Type |
PARALLEL IO PORT, GENERAL PURPOSE
|
PARALLEL IO PORT, GENERAL PURPOSE
|
Base Number Matches |
2
|
2
|
|
|
|
Compare MAX7311AUG+ with alternatives
Compare MAX7311AWG+ with alternatives