MAX7301ATL+
vs
MAX7300AGL
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
QFN
|
QFN
|
Pin Count |
40
|
40
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
|
HTS Code |
8542.39.00.01
|
|
Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
JESD-30 Code |
S-XQCC-N40
|
S-XQCC-N40
|
JESD-609 Code |
e3
|
e0
|
Length |
6 mm
|
6 mm
|
Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
Number of Functions |
1
|
1
|
Number of Terminals |
40
|
40
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
245
|
Qualification Status |
Not Qualified
|
COMMERCIAL
|
Seated Height-Max |
0.8 mm
|
0.85 mm
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.5 V
|
2.5 V
|
Supply Voltage-Nom |
3.3 V
|
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
6 mm
|
6 mm
|
Base Number Matches |
2
|
2
|
Package Description |
|
6 X 6 MM, 0.90 MM HEIGHT, MO-220, QFN-40
|
|
|
|
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