MAX6956ATL+
vs
MAX7300AGL
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
MAXIM INTEGRATED PRODUCTS INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
QFN
|
| Package Description |
ROHS COMPLIANT, TQFN-40
|
6 X 6 MM, 0.90 MM HEIGHT, MO-220, QFN-40
|
| Pin Count |
40
|
40
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
COMMON-ANODE
|
|
| Display Mode |
SEGMENT
|
|
| Interface IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| JESD-30 Code |
S-XQCC-N40
|
S-XQCC-N40
|
| JESD-609 Code |
e3
|
e0
|
| Length |
6 mm
|
6 mm
|
| Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
| Number of Digits/Characters |
7-DIGIT
|
|
| Number of Functions |
1
|
1
|
| Number of Segments |
7
|
|
| Number of Terminals |
40
|
40
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC40,.24SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
0.8 mm
|
0.85 mm
|
| Supply Voltage-Max |
5.5 V
|
5.5 V
|
| Supply Voltage-Min |
2.5 V
|
2.5 V
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
MATTE TIN
|
TIN LEAD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
6 mm
|
6 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
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