MAX6138BEXR25+
vs
MAX6138AEXR25+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Part Package Code |
3-SC70-N/A
|
3-SC70-N/A
|
| Pin Count |
3
|
3
|
| Manufacturer Package Code |
3-SC70-N/A
|
3-SC70-N/A
|
| Date Of Intro |
2001-11-21
|
2001-11-21
|
| Analog IC - Other Type |
TWO TERMINAL VOLTAGE REFERENCE
|
TWO TERMINAL VOLTAGE REFERENCE
|
| JESD-30 Code |
R-PDSO-G3
|
R-PDSO-G3
|
| JESD-609 Code |
e3
|
e3
|
| Length |
2 mm
|
2 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
3
|
3
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Voltage-Max |
2.505 V
|
2.5025 V
|
| Output Voltage-Min |
2.495 V
|
2.4975 V
|
| Output Voltage-Nom |
2.5 V
|
2.5 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP3/6,.08
|
TSSOP3/6,.08
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Current-Max (Isup) |
15 mA
|
15 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
BICMOS
|
BICMOS
|
| Temp Coef of Voltage-Max |
25 ppm/°C
|
25 ppm/°C
|
| Terminal Finish |
Matte Tin (Sn)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Trim/Adjustable Output |
NO
|
NO
|
| Voltage Tolerance-Max |
0.2%
|
0.1%
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
2
|
2
|
| Samacsys Manufacturer |
|
Analog Devices
|
|
|
|
Compare MAX6138BEXR25+ with alternatives
Compare MAX6138AEXR25+ with alternatives