MAX4717EBC-T
vs
MAX4717EUB/GH9
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
Package Description
2 X 1.5 MM, UCSP-12
Pin Count
12
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-XBGA-B12
JESD-609 Code
e0
Length
2.02 mm
Moisture Sensitivity Level
1
Number of Channels
1
Number of Functions
2
Number of Terminals
12
Off-state Isolation-Nom
55 dB
On-state Resistance Match-Nom
0.1 Ω
On-state Resistance-Max (Ron)
4.5 Ω
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Output
SEPARATE OUTPUT
Package Body Material
UNSPECIFIED
Package Code
VFBGA
Package Equivalence Code
BGA12,3X4,20
Package Shape
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
245
NOT SPECIFIED
Qualification Status
Not Qualified
Seated Height-Max
0.67 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
Supply Voltage-Nom (Vsup)
3 V
Surface Mount
YES
Switch-off Time-Max
40 ns
Switch-on Time-Max
80 ns
Switching
BREAK-BEFORE-MAKE
Technology
BICMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
Terminal Pitch
0.5 mm
Terminal Position
BOTTOM
Width
1.54 mm
Base Number Matches
1
1
Factory Lead Time
4 Weeks
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MAX4717EBC-T with alternatives
Compare MAX4717EUB/GH9 with alternatives