MAX4717EBC-T
vs
MAX4717EUB
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
BGA
TSSOP
Package Description
2 X 1.5 MM, UCSP-12
TSSOP, TSSOP10,.19,20
Pin Count
12
10
Reach Compliance Code
not_compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Analog IC - Other Type
SPDT
SPDT
JESD-30 Code
R-XBGA-B12
S-PDSO-G10
JESD-609 Code
e0
e0
Length
2.02 mm
3 mm
Moisture Sensitivity Level
1
1
Number of Channels
1
1
Number of Functions
2
2
Number of Terminals
12
10
Off-state Isolation-Nom
55 dB
55 dB
On-state Resistance Match-Nom
0.1 Ω
0.1 Ω
On-state Resistance-Max (Ron)
4.5 Ω
4.5 Ω
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output
SEPARATE OUTPUT
SEPARATE OUTPUT
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
VFBGA
TSSOP
Package Equivalence Code
BGA12,3X4,20
TSSOP10,.19,20
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
245
245
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
0.67 mm
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
1.8 V
1.8 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Switch-off Time-Max
40 ns
40 ns
Switch-on Time-Max
80 ns
80 ns
Switching
BREAK-BEFORE-MAKE
BREAK-BEFORE-MAKE
Technology
BICMOS
BICMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Width
1.54 mm
3 mm
Base Number Matches
1
1
Compare MAX4717EBC-T with alternatives
Compare MAX4717EUB with alternatives