MAX4581AUE+
vs
HEF4053BP,652
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Part Package Code |
16-TSSOP_4.4-4.4_MM
|
DIP
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
16-TSSOP_4.4-4.4_MM
|
SOT38-4
|
| Date Of Intro |
1998-01-03
|
|
| Samacsys Manufacturer |
Analog Devices
|
NXP
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e3
|
e4
|
| Length |
5 mm
|
21.6 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-6 V
|
|
| Neg Supply Voltage-Min (Vsup) |
-2 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
| Number of Channels |
8
|
2
|
| Number of Functions |
1
|
3
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
73 dB
|
50 dB
|
| On-state Resistance Match-Nom |
1 Ω
|
5 Ω
|
| On-state Resistance-Max (Ron) |
80 Ω
|
175 Ω
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Equivalence Code |
TSSOP16,.25
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
4.7 mm
|
| Signal Current-Max |
0.02 A
|
0.01 A
|
| Supply Current-Max (Isup) |
0.01 mA
|
0.6 mA
|
| Supply Voltage-Max (Vsup) |
6 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
100 ns
|
220 ns
|
| Switch-on Time-Max |
200 ns
|
140 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Matte Tin (Sn)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| Ihs Manufacturer |
|
NXP SEMICONDUCTORS
|
| Package Description |
|
DIP, DIP16,.3
|
| Reach Compliance Code |
|
compliant
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
Compare MAX4581AUE+ with alternatives
Compare HEF4053BP,652 with alternatives