MAX4219EEE+
vs
MAX469C/D
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
No
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MAXIM INTEGRATED PRODUCTS INC
MAXIM INTEGRATED PRODUCTS INC
Part Package Code
SOIC
DIE
Package Description
0.150 INCH, 0.025 INCH PITCH, QSOP-16
DIE,
Pin Count
16
Reach Compliance Code
compliant
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.33.00.01
Amplifier Type
BUFFER
BUFFER
Average Bias Current-Max (IIB)
12 µA
5 µA
Bandwidth (3dB)-Nom
200 MHz
90 MHz
Input Offset Voltage-Max
10000 µV
15000 µV
JESD-30 Code
R-PDSO-G16
X-XUUC-N
JESD-609 Code
e3
Length
4.89 mm
Moisture Sensitivity Level
1
1
Neg Supply Voltage Limit-Max
-6 V
Neg Supply Voltage-Nom (Vsup)
-5 V
Number of Functions
3
3
Number of Terminals
16
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Output Current-Min
0.06 A
0.02 A
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SSOP
DIE
Package Equivalence Code
SSOP16,.25
Package Shape
RECTANGULAR
UNSPECIFIED
Package Style
SMALL OUTLINE, SHRINK PITCH
UNCASED CHIP
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Slew Rate-Nom
600 V/us
300 V/us
Supply Current-Max
21 mA
100 mA
Supply Voltage Limit-Max
12 V
6 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
BIPOLAR
BIPOLAR
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
0.635 mm
Terminal Position
DUAL
UPPER
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
Base Number Matches
2
1
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Compare MAX469C/D with alternatives